Omron’s VT-X750 Automatic X-ray Inspection system incorporates AI in the latest solution for manufacturers desiring high quality, in-line, automated X-ray inspection on PCBs, containing components such as BGAs or LGAs and through-hole connector.
In the autonomous vehicle and in all the associated systems necessary for autonomous driving, more and more electronic safety components are being integrated. The number of components are becoming more and more extensive, from camera systems, sensor systems and wireless communication interfaces through to intelligent light systems and navigation aids. We are convinced, that a complete inspection process is needed, and we have been developing the necessary technology.
Omron target design is with the philosophy to achieve Zero Defect process lines. Automated X-ray Inspection are becoming more and more essential to meet customer demands in high quality standards. Traditional X-ray technologies such as 2.5D, 3D Laminography and Tomosynthesis are limited to inspect components like BGAs, LGAs or THT. Omron VT-X750’s design overcomes these traditional shortfalls by incorporating high speed ‘Computed Tomography’ (CT), providing high-precision X-ray imaging to perform precise and reliable inspection of those hidden soldered areas during production. Combining Computed Tomography with High-Speed image capture and processing, VT-X750 delivers the highest-level inspection capability, targeting requirements such as the Autonomous Vehicle and EV where safety and reliability are paramount.
VT-X750 In-Line AXI system will inspect precisely and reliably of difficult soldered defects such as Head in Pillow and voids within BGA, PoP, LGA, THT and all other discrete devices. Together with technological improvements in cycle time where image processing of less 3.5 secs per field of view, are key for modern day in-line manufacturing processes.
New software design incorporates unique AI functions that assists and improves programming and tuning process by up to 5 times faster than our previous models, depending on the complexity of PCB. AI in combination of improved logics support easy operation for operators allowing to focus on other production activities. Other targets for AI are automatic setting of the x-ray tube voltage improving image quality and improving cycle times to an increasing customer satisfaction.
