Omron introduced the VT-S530 inspection system and the VT-X750 automatic high-speed X-ray inspection system at this year's SMT, and was able to record strong interest in both systems. Customers' discussions here focussed especially on high capability Solder Joint Inspection combining, high-speed in-line inspection.
"This year's SMT was very successful for us", confirms Kevin Youngs, key account manager — Automated Inspection Business Europe at Omron Europe B.V. "It turns out that the absolutely precise high-speed inspection of components has become extremely interesting for individual industries”, Youngs explains further. Particularly the Automotive supply industry sees opportunities in the component-inspection possibilities for accelerating the production process whilst maintaining quality reliability.
The VT-S530 and VT-X750 inspection systems introduced at the trade show enable Three-Dimensional Solder Joint Inspection (3D-SJI) in which visual as well as non-visual inspection processes are combined to capture 3D shape of solder. Therefore, 3D technology computer tomography (3D CT) is employed for non-visual X-ray inspection. In order to enable exact high-speed inspection, Omron has developed the parallel CT imaging inspection principle. Here, the X-ray camera is guided horizontally without rotation into the stationary XY image-acquisition system in order to achieve a large field of view and hence reduce the amount of field of views.
